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July 2, 2024

What is a Barrier Device?

The term ‘barrier device’ refers to a protective piece of equipment that is used during mouth-to-mouth resuscitation (CPR). When used correctly, these devices prevent the transfer of bloodborne pathogens between the rescuer and casualty. They are a vital piece of equipment for people in the medical field, such as doctors, nurses, paramedics and EMTs. They are also useful for first responders, such as police officers and firefighters.

The purpose of these devices is to help save lives during emergencies like cardiac arrest and drowning. Without prompt, effective CPR and rescue breathing, the survival rate of a victim decreases by 7% per minute that the victim isn’t receiving oxygen from their body. For this reason, it’s important that bystanders are confident in their ability to provide lifesaving assistance. This is especially important for those who are responsible for ensuring the safety of individuals in aquatic environments, such as lifeguards and swim instructors. By keeping barrier devices on hand, they can be ready to quickly assist a victim in an emergency.

For this reason, it’s important that everyone understands what a barrier device is and how to properly use them. Educating employees on the importance of barrier device use is critical to maintaining workplace safety and compliance with OSHA’s bloodborne pathogen standards.

There are many different types of barrier devices, including face shields and pocket masks. The most commonly used are the CPR face shields and pocket masks with one-way valves. These devices are designed to protect the rescuer from infection during mouth-to-mouth resuscitation by creating a physical barrier between the rescuer’s face and the casualty’s. They also feature a one-way valve to prevent backflow of fluids into the rescuer’s mouth. The one-way valves also allow the user to perform rescue breaths without having to close their mouth or touch their lips to the casualty.

In a variation of the basic process, an alloy barrier deposition step 164 may be substituted for the standard alloy layer deposition step 152. This step involves depositing a non-oxidizable refractory noble metal barrier layer, such as a tantalum nitride, on the dielectric layer, followed by deposition of a ternary alloy layer on top of the nitride. The ternary alloy layers may comprise, for example, AlRuTa. In this particular embodiment, the barrier layer and ternary alloy layer are both deposited by magnetron sputtering using a ruthenium target.